Selective Solder

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2019 Hentec RPS Vector 460 Selective Soldering Machine

Manufacturer: Hentec RPS
Model: Vector 460
Reference No.:  313L

Hentec RPS Vector 460 Selective Soldering Machine Specifications:

  • High performance selective soldering machine with two multi-nozzles
  • Process range of 18” x 18”
  • Perfect for mid-volume production
  • Please contact SMT Sales Group for additional information

Vector 460 Spec Sheet

Click the images below for additional views.

Contact SMT Sales Group using the form below or email sales@smtsalesgroup.com for additional information or inquiries.

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    Apollo Seiko Selective Soldering Robot

    Make: Apollo Seiko
    Model: JR2300Ne
    DOM: 2012
    Reference No.: 239NC

    Specification:
    Power – AC 90V ~ AC 164V
    Power Consumption – 166W
    Air Supply – 0.4 ~ 0.5 MPa
    Solder Wire Diameter – φ0.4 ~ 2.0 (Option: φ0.3)
    Solder Condition – 297 conditions
       Point Soldering 99
       Slide Soldering 99
       Special Soldering 99
    Temperature Setting – 0 ~ 500℃
    Heater Capacity – 200W
    Solder Step – 9 Steps
    Standby Temperature – 250℃ (Adjustable)
    Constitution
       TERRA Controller ×1
       Iron Unit (RSP/RSL) ×1
       Solder Feeder Unit (LFD) ×1
       Solder Wire Feeding Tube (TAL*.*-***S**) ×1
       Iron Cable (CC3F-1700 Standard 1700mm) ×1
       Feeder Cable (MC-1-1700 Standard 1700mm) ×1
       Air Tube Set for Iron Unit ×1
       Power Supply Cable ×1
       Iron Cartridge ×1
       Silicone Ring ×3
       Silicone Tube for Iron Cartridge Replacement ×2

    Condition: Like New Complete & Operational
    Availability: Immediate for purchase / 2-6 weeks for shipping

    Actual Machine Photos:

    Contact SMT Sales Group using the form below or email sales@smtsalesgroup.com for additional information or inquiries.

    FAST response, within an hour or less.

      2015 Pillarhouse Jade S200 MKII Selective Soldering System

      Make: Pillarhouse
      Model:  Jade S200 MKII
      Year: 2015
      Reference No.:  236NC
      Details:
      • Height: 1403mm / 55” – excluding light stack
      • Width: 1000mm / 40“
      • Depth: 1351mm / 53”
      • Board size: 457mm x 508mm / 18”x 20” (larger PCB size available upon request)
      • Edge clearance: Above / below 3mm
      • Height clearance: Above / below 40mm nominal
        Above 190mm – special application
      • Solder: Most commonly used solder types – including lead-free
      • Solder pot capacity: 8kg
      • Applicators: AP style – 2.5mm to 16mm dia.
        Extended AP style – 2.5mm to 20mm dia.
        Micro nozzle – 1.5mm to 2.5mm
        Jet-Tip style – 6mm to 20mm dia.
        Jet-Wave nozzle – up to 25mm width
        Special dedicated nozzles available upon request
      • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available
      • X, Y & Z Axis resolution: 0.1mm
      • Repeatability: +/- 0.05mm
      • Nitrogen usage: 35 litres gas/min. 5 bar pressure
      • Nitrogen purity: 99.995% or better
      • Air supply pressure: 5 bar / 72 psi
      • Power supplies: Single phase + PE
      • Voltage: 208V – 250V
      • Frequency: 50/60Hz
      • Power : 4kVA
      • Power with IR preheat: 6.5kVA – Top-side
        8kVA – Top with bottom-side ring heater
      • Transport: Hand load
      • Tooling: Integral adjustable board guides, includes finger extensions and board clamps
      • Programming: PillarCOMM Windows® based ‘Point & Click’ interface
      Description

      As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialized nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.

      As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidization and provides a local preheat to the joint, thus reducing thermal shock to localized components.

      The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.
      Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.


          

      Condition:  Complete and  Operational
      Location & Shipping:  USA / FOB Origin
       
      Actual Machine Photos:

      Contact SMT Sales Group using the form below or email sales@smtsalesgroup.com for additional information or inquiries.

      FAST response, within an hour or less.